High-Performance Microwave Assembly Enables Inside & Between-Box Connections

Times Microwave Systems' InstaBend 141 microwave assembly enables extreme bending from the back of the connector for minimal footprint in inside-the-box and between-box connections in military and commercial applications By DA Reporter / 29 Mar 2023
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Times Microwave Systems, developer of RF and microwave interconnect assemblies, cables, and connectors, has introduced its new InstaBend 141 (IB-141) high-performance microwave assembly. 

According to the company, IB-141 provides a larger-diameter, lower-loss addition to Times Microwave Systems’ InstaBend family of microwave assemblies, which feature a flexible preassembled design for interconnects between RF circuit cards, modules, and enclosure panels.

IB-141 is designed for both inside-the-box and between-box connections in applications including space flight, thermal vacuum, microwave test, and many other military and commercial applications. 

The microwave assembly’s diameter (0.163 in./4.14 mm) enables lower loss for applications with stringent requirements in a form that is lighter weight than traditional semi-rigid cables. Its small bend radius and flexibility enable low-profile installation, easier routing, and tool-free bending compared to semi-rigid cables, with a maximum frequency of 27 GHz.

IB-141 is designed with focus on a robust cable-connector junction that can withstand tight bends without performance degradation. Like all InstaBend assemblies, the cable can be bent very closely behind the connector, minimizing footprint, saving space, and simplifying cable routing.

“The new InstaBend 141 expands on the unique low-profile bendability of our InstaBend product family, which enables very tight turns in limited space, with a larger, but lower loss cable option,” said Kai Loh, Product Solutions Manager at Times Microwave Systems. “The ability to bend the cable close to the connector back-end without compromising mechanical integrity and electrical performance adds flexibility to high-density system design.”

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