Discover the next generation of ultra-compact computing with Atrenne’s 726 Series VITA 90-VNX+ chassis.
Designed specifically for Extreme Size, Weight, and Power (SWaP-C) constraints, this modular chassis is 4.5 times smaller than a traditional 3U OpenVPX system. Whether for unmanned vehicles, small satellites, or missile pods, the 726 Series provides high-performance data transfer in a rugged, conduction-cooled enclosure.
Key Features:
- Ultra-Compact Design: Optimized for platforms where every gram and millimeter counts.
- Conduction Cooled: No internal fans required, ensuring reliability in harsh, dusty, or extreme temperature environments.
- VITA 90 Compliant: Modular design ensures vendor interoperability and easy upgrades for processors or I/O modules.
- High-Throughput Backplanes: Supports modern serial fabrics, including PCI Express (Gen3/Gen4) and 100GbE.
- Flexible Scalability: Available in 3-slot or 6-slot versions with hybrid capability for various module heights.
