Lenovo ThinkEdge systems provide compact, ruggedized computing for organizations that need to process data closer to the point of collection. Designed for edge environments where space, reliability and remote manageability are key requirements, the range is well suited to defence and government users deploying compute capability outside traditional data centre environments.
The ThinkEdge SE30 is a compact edge client designed for enterprise automation, smart buildings and industrial IoT applications. Powered by Intel Core processors, the system supports Wi-Fi, Bluetooth, 4G LTE and 5G WWAN connectivity, with an IOBOX option for additional expansion. Its fanless design, compact 0.81L form factor and MIL-STD-tested reliability allow it to support uninterrupted operation in harsh environments where conventional desktop systems may not be practical.
For more demanding edge workloads, the ThinkEdge SE360 V2 provides a rugged, compact edge server based on Intel Xeon D-2700 processors. The 2U, half-width, short-depth system is designed for non-data-centre environments and supports edge computing, edge AI, hybrid cloud and workloads at edge locations. With support for challenging temperature, dust and vibration conditions, as well as Lenovo ThinkShield security, XClarity management, wired and secure wireless connectivity, and redundant boot and data drive options, the SE360 V2 provides a strong foundation for distributed mission-critical computing.
Specifications:
| Lenovo ThinkEdge SE30 | Lenovo ThinkEdge SE360 V2 | |
| Form Factor | Compact edge client; 179 x 88 x 51.5 mm; around 1.02 kg. VESA, DIN rail, Z hook and other mounting options available. | ThinkEdge, 2U high; 84.5 x 212 x 317.5 mm; max weight 6.5 kg without external AC adapter. Standalone, desktop, DIN rail, wall, ceiling or standard rack (2U2N) mounting options. |
| Processor | Intel Celeron 6305E or 11th Gen Intel Core i3/i5 processors, including Core i3-1115GRE, Core i5-1145G7E and Core i5-1145GRE options. | One Intel Xeon D-2700 Series processor, soldered to the system board; up to 16 cores, up to 2.1 GHz core speed and up to 100 W TDP. |
| GPU Support | Integrated Intel UHD Graphics or Intel Iris Xe Graphics; supports up to 3 independent displays via onboard ports. | Supports up to two low-profile PCIe GPU adapters. Lenovo lists support for NVIDIA A2, NVIDIA L4 and Qualcomm Cloud AI 100 for edge workloads. |
| Memory | Up to 16 GB soldered DDR4-3200 memory, not upgradable; no memory slots, dual-channel. | 4 DIMM slots; up to 256 GB using 4 x 64 GB TruDDR4 RDIMMs operating at 3200 MHz; ECC and SDDC memory protection. |
| Drive Bays | Up to two M.2 SSD drives: M.2 2280 SSD up to 2 TB each or M.2 2230 SSD up to 1 TB each; RAID 0/1 support. | Up to 2 x 7 mm hot-swap NVMe/SATA bays; up to 8 x 2280/22110 NVMe M.2 data drives; I/O module supports up to 2 x 2280 NVMe M.2 boot drives. |
| Expansion Slots | Three M.2 slots: one for WLAN and two for SSD. Optional SE30 IO box provides additional serial, PoE RJ-45, DIO, USB-C and DC-in connectivity. | Up to two PCIe 4.0 x16 slots: one full-height half-length plus one half-height half-length, or two half-height half-length slots. Riser options also support M.2 storage. |
