LCR Embedded Systems has explored how ever increasing data rates and processing speeds, brought about by new high speed sensor and computer equipment used in defense scenarios, is pushing the thermal limits in 3U VPX and SOSA aligned systems.
In the article “Thermal Management Challenges in SOSA Systems” the company detail how traditional methods of cooling are challenged in ensuring failsafe operation within critical C5ISR applications.
LCR Embedded Systems explain that the internal heat generated by systems has multiplied since the introduction of VPX systems, with high speed FPGA and CPU 3U modules, required for advanced RF / EW / SIGNINT applications, topping out at nearly 200W TDP (total dissipated power) at full rate due to the higher data rates.
This poses significant challenges with thermal management. In the full article, the company discuss internal heat mitigation strategies for SOSA aligned systems, covering:
- Design Considerations
- Module Design
- Chassis Design
- Mixed Module Support – 48.2, 48.4, 48.8
- New Chassis Design Options
As the trend towards higher power in 3U VPX modules continues, LCR Embedded Systems is addressing the concerns and challenges associated with thermal management in SOSA aligned systems by addressing chassis development considerations.
Read the full article, or find out more at LCR Embedded Systems’ website.
