Teledyne FLIR OEM has released the ITAR-free Boson SX8, the first NDAA-compliant, volume production, uncooled longwave infrared thermal camera module to combine an 8-micron pixel pitch with SXGA resolution.
The Boson SX8 family delivers four times the resolution of today’s high-volume, uncooled VGA thermal camera modules within a similarly sized compact package. Designed for defense and industrial applications with size, weight, and power constraints, the product family is intended for use in uncrewed aircraft systems, counter-UAS, perimeter security, handheld devices, seekers, visual augmentation, and intelligence, surveillance, and reconnaissance systems.
According to Teledyne FLIR OEM, the Boson SX8 family delivers performance previously available only in heavier, larger, and more power-hungry cooled midwave infrared thermal imaging systems.
Paul Clayton, President, Teledyne FLIR OEM, commented, “By reducing pixel area by 55% compared to the standard 12-micron LWIR pixel format, Boson SX8 represents a transformational moment for thermal imaging. By pairing this advanced 8-micron pixel architecture with SXGA thermal resolution at full-rate production, we’re giving customers greater situational awareness and longer effective range without compromising SWaP or supply-chain confidence.”
Alongside multiple fixed-lens options, the company is introducing the Boson SX8-CZ 15–75, which features a factory-integrated 5x continuous-zoom lens to extend range performance. Engineered and calibrated as a single system, this option pairs the camera module with a 15–75 mm continuous-zoom lens. The integrated system provides focus-through-zoom, thermal gradient compensation, factory alignment, and a single-source warranty, which reduces integration risk and accelerates time to market.
Both the Boson SX8 and the Boson SX8-CZ 15–75 are manufactured at high volume in the United States. Designed to offer OEMs a low-risk path from development through full-rate manufacturing, the camera family also includes integration with Teledyne FLIR OEM’s Prism intelligent embedded software products.
The company will demonstrate the new product family at Eurosatory 2026 at the Teledyne FLIR booth in Paris, where attendees can experience the latest advances in high-definition, size, weight, and power-optimized thermal imaging.
