This video highlights the Boson+ IQ Development Kit from Teledyne FLIR OEM, a platform that brings thermal infrared sensing and AI together at the edge.
Powered by the Qualcomm® Dragonwing™ QCS8550 system on chip (SoC), it delivers up to 50 trillion operations per second while adding only 2.5 watts of power. This enables Prism™ AI object detection, advanced image signal processing, and real-time decision support with minimal thermal load and maximum efficiency.
With three MIPI interfaces for Boson+ thermal and additional cameras, SDKs, interface hardware, and expert engineering support, the kit streamlines development for integrators. Features like multi-object tracking, super-resolution, denoising, and automatic gain control are supported today, with forward compatibility for Prism SKR and future software enhancements.
